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C++ D_PAD::BuildPadDrillShapePolygon方法代码示例

本文整理汇总了C++中D_PAD::BuildPadDrillShapePolygon方法的典型用法代码示例。如果您正苦于以下问题:C++ D_PAD::BuildPadDrillShapePolygon方法的具体用法?C++ D_PAD::BuildPadDrillShapePolygon怎么用?C++ D_PAD::BuildPadDrillShapePolygon使用的例子?那么, 这里精选的方法代码示例或许可以为您提供帮助。您也可以进一步了解该方法所在D_PAD的用法示例。


在下文中一共展示了D_PAD::BuildPadDrillShapePolygon方法的1个代码示例,这些例子默认根据受欢迎程度排序。您可以为喜欢或者感觉有用的代码点赞,您的评价将有助于系统推荐出更棒的C++代码示例。

示例1: GetBoard

void EDA_3D_CANVAS::buildBoardThroughHolesPolygonList( SHAPE_POLY_SET& allBoardHoles,
                                                int aSegCountPerCircle, bool aOptimizeLargeCircles )
{
    // hole diameter value to change seg count by circle:
    int small_hole_limit = Millimeter2iu( 1.0 );
    int copper_thickness = GetPrm3DVisu().GetCopperThicknessBIU();

    BOARD* pcb = GetBoard();

    // Build holes of through vias:
    for( TRACK* track = pcb->m_Track;  track;  track = track->Next() )
    {
        if( track->Type() != PCB_VIA_T )
            continue;

        VIA *via = static_cast<VIA*>( track );

        if( via->GetViaType() != VIA_THROUGH )
            continue;

        int holediameter = via->GetDrillValue();
        int hole_outer_radius = (holediameter + copper_thickness) / 2;

        TransformCircleToPolygon( allBoardHoles,
                                  via->GetStart(), hole_outer_radius,
                                  aSegCountPerCircle );
    }

    // Build holes of through pads:
    for( MODULE* footprint = pcb->m_Modules; footprint; footprint = footprint->Next() )
    {
        for( D_PAD* pad = footprint->Pads(); pad; pad = pad->Next() )
        {
            // Calculate a factor to apply to segcount for large holes ( > 1 mm)
            // (bigger pad drill size -> more segments) because holes in pads can have
            // very different sizes and optimizing this segcount gives a better look
            // Mainly mounting holes have a size bigger than small_hole_limit
            wxSize padHole = pad->GetDrillSize();

            if( ! padHole.x )       // Not drilled pad like SMD pad
                continue;

            // we use the hole diameter to calculate the seg count.
            // for round holes, padHole.x == padHole.y
            // for oblong holes, the diameter is the smaller of (padHole.x, padHole.y)
            int diam = std::min( padHole.x, padHole.y );
            int segcount = aSegCountPerCircle;

            if( diam > small_hole_limit )
            {
                double segFactor = (double)diam / small_hole_limit;
                segcount = (int)(aSegCountPerCircle * segFactor);

                // limit segcount to 48. For a circle this is a very good approx.
                if( segcount > 48 )
                    segcount = 48;
            }

            // The hole in the body is inflated by copper thickness.
            int inflate = copper_thickness;

            // If not plated, no copper.
            if( pad->GetAttribute () == PAD_HOLE_NOT_PLATED )
                inflate = 0;

            pad->BuildPadDrillShapePolygon( allBoardHoles, inflate, segcount );
        }
    }

    allBoardHoles.Simplify();
}
开发者ID:MarcoHess,项目名称:kicad-source-mirror,代码行数:71,代码来源:3d_draw_board_body.cpp


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