C++ BOARD_ITEM::IsOnLayer方法代码示例

void BOARD::ConvertBrdLayerToPolygonalContours( PCB_LAYER_ID aLayer, SHAPE_POLY_SET& aOutlines )
{
    // convert tracks and vias:
    for( TRACK* track = m_Track; track != NULL; track = track->Next() )
    {
        if( !track->IsOnLayer( aLayer ) )
            continue;

        track->TransformShapeWithClearanceToPolygon( aOutlines, 0 );
    }

    // convert pads
    for( MODULE* module = m_Modules; module != NULL; module = module->Next() )
    {
        module->TransformPadsShapesWithClearanceToPolygon( aLayer, aOutlines, 0 );

        // Micro-wave modules may have items on copper layers
        module->TransformGraphicShapesWithClearanceToPolygonSet( aLayer, aOutlines, 0 );
    }

    // convert copper zones
    for( int ii = 0; ii < GetAreaCount(); ii++ )
    {
        ZONE_CONTAINER* zone = GetArea( ii );
        PCB_LAYER_ID        zonelayer = zone->GetLayer();

        if( zonelayer == aLayer )
            zone->TransformSolidAreasShapesToPolygonSet( aOutlines );
    }

    // convert graphic items on copper layers (texts)
    for( BOARD_ITEM* item = m_Drawings; item; item = item->Next() )
    {
        if( !item->IsOnLayer( aLayer ) )
            continue;

        switch( item->Type() )
        {
        case PCB_LINE_T:
            ( (DRAWSEGMENT*) item )->TransformShapeWithClearanceToPolygon( aOutlines, 0 );
            break;

        case PCB_TEXT_T:
            ( (TEXTE_PCB*) item )->TransformShapeWithClearanceToPolygonSet( aOutlines, 0 );
            break;

        default:
            break;
        }
    }
}

void EDA_3D_CANVAS::buildTechLayers3DView( REPORTER* aErrorMessages, REPORTER* aActivity )
{
    BOARD* pcb = GetBoard();
    bool useTextures = isRealisticMode() && isEnabled( FL_RENDER_TEXTURES );

    // Number of segments to draw a circle using segments
    const int       segcountforcircle   = 18;
    double          correctionFactor    = 1.0 / cos( M_PI / (segcountforcircle * 2) );
    const int       segcountLowQuality  = 12;   // segments to draw a circle with low quality
                                                // to reduce time calculations
                                                // for holes and items which do not need
                                                // a fine representation

    double          correctionFactorLQ = 1.0 / cos( M_PI / (segcountLowQuality * 2) );

    // segments to draw a circle to build texts. Is is used only to build
    // the shape of each segment of the stroke font, therefore no need to have
    // many segments per circle.
    const int       segcountInStrokeFont = 8;

    SHAPE_POLY_SET bufferPolys;
    SHAPE_POLY_SET allLayerHoles;              // Contains through holes, calculated only once
    SHAPE_POLY_SET bufferPcbOutlines;          // stores the board main outlines

    // Build a polygon from edge cut items
    wxString msg;

    if( !pcb->GetBoardPolygonOutlines( bufferPcbOutlines, allLayerHoles, &msg ) )
    {
        if( aErrorMessages )
        {
            msg << wxT("\n") <<
                _("Unable to calculate the board outlines.\n"
                  "Therefore use the board boundary box.") << wxT("\n\n");
            aErrorMessages->Report( msg, REPORTER::RPT_WARNING );
        }
    }

    // Build board holes, with no optimization of large holes shape.
    buildBoardThroughHolesPolygonList( allLayerHoles, segcountLowQuality, false );

    // draw graphic items, on technical layers

    static const LAYER_ID teckLayerList[] = {
        B_Adhes,
        F_Adhes,
        B_Paste,
        F_Paste,
        B_SilkS,
        F_SilkS,
        B_Mask,
        F_Mask,
    };

    // User layers are not drawn here, only technical layers
    for( LSEQ seq = LSET::AllTechMask().Seq( teckLayerList, DIM( teckLayerList ) );  seq;  ++seq )
    {
        LAYER_ID layer = *seq;

        if( !is3DLayerEnabled( layer ) )
            continue;

        if( layer == Edge_Cuts && isEnabled( FL_SHOW_BOARD_BODY )  )
            continue;

        if( aActivity )
            aActivity->Report( wxString::Format( _( "Build layer %s" ), LSET::Name( layer ) ) );

        bufferPolys.RemoveAllContours();

        for( BOARD_ITEM* item = pcb->m_Drawings; item; item = item->Next() )
        {
            if( !item->IsOnLayer( layer ) )
                continue;

            switch( item->Type() )
            {
            case PCB_LINE_T:
                ( (DRAWSEGMENT*) item )->TransformShapeWithClearanceToPolygon(
                        bufferPolys, 0, segcountforcircle, correctionFactor );
                break;

            case PCB_TEXT_T:
                ( (TEXTE_PCB*) item )->TransformShapeWithClearanceToPolygonSet(
                        bufferPolys, 0, segcountLowQuality, 1.0 );
                break;

            default:
                break;
            }
        }

        for( MODULE* module = pcb->m_Modules; module; module = module->Next() )
        {
            if( layer == F_SilkS || layer == B_SilkS )
            {
                // On silk screen layers, the pad shape is only the pad outline
                // never a filled shape
                D_PAD*  pad = module->Pads();
                int     linewidth = g_DrawDefaultLineThickness;
//.........这里部分代码省略.........

void EDA_3D_CANVAS::buildBoard3DView( GLuint aBoardList, GLuint aBodyOnlyList,
                                      REPORTER* aErrorMessages, REPORTER* aActivity  )
{
    BOARD* pcb = GetBoard();

    // If FL_RENDER_SHOW_HOLES_IN_ZONES is true, holes are correctly removed from copper zones areas.
    // If FL_RENDER_SHOW_HOLES_IN_ZONES is false, holes are not removed from copper zones areas,
    // but the calculation time is twice shorter.
    bool remove_Holes = isEnabled( FL_RENDER_SHOW_HOLES_IN_ZONES );

    bool realistic_mode = isRealisticMode();
    bool useTextures = isRealisticMode() && isEnabled( FL_RENDER_TEXTURES );

    // Number of segments to convert a circle to polygon
    // We use 2 values: the first gives a good shape (for instanes rond pads)
    // the second is used to speed up calculations, when a poor approximation is acceptable (holes)
    const int       segcountforcircle   = 18;
    double          correctionFactor    = 1.0 / cos( M_PI / (segcountforcircle * 2.0) );
    const int       segcountLowQuality  = 12;   // segments to draw a circle with low quality
                                                // to reduce time calculations
                                                // for holes and items which do not need
                                                // a fine representation
    double          correctionFactorLQ  = 1.0 / cos( M_PI / (segcountLowQuality * 2.0) );

    SHAPE_POLY_SET  bufferPolys;        // copper areas: tracks, pads and filled zones areas
                                        // when holes are removed from zones
    SHAPE_POLY_SET  bufferPcbOutlines;  // stores the board main outlines
    SHAPE_POLY_SET  bufferZonesPolys;   // copper filled zones areas
                                        // when holes are not removed from zones
    SHAPE_POLY_SET  currLayerHoles;     // Contains holes for the current layer
    SHAPE_POLY_SET  allLayerHoles;      // Contains holes for all layers

    // Build a polygon from edge cut items
    wxString msg;

    if( !pcb->GetBoardPolygonOutlines( bufferPcbOutlines, allLayerHoles, &msg ) )
    {
        if( aErrorMessages )
        {
            msg << wxT("\n") << _("Unable to calculate the board outlines.\n"
                                  "Therefore use the board boundary box.") << wxT("\n\n");

            aErrorMessages->Report( msg, REPORTER::RPT_WARNING );
        }
    }

    // Build board holes, with optimization of large holes shape.
    buildBoardThroughHolesPolygonList( allLayerHoles, segcountLowQuality, true );

    LSET            cu_set = LSET::AllCuMask( GetPrm3DVisu().m_CopperLayersCount );

    glNewList( aBoardList, GL_COMPILE );

    for( LSEQ cu = cu_set.CuStack();  cu;  ++cu )
    {
        LAYER_ID layer = *cu;

        // Skip non enabled layers in normal mode,
        // and internal layers in realistic mode
        if( !is3DLayerEnabled( layer ) )
            continue;

        if( aActivity )
            aActivity->Report( wxString::Format( _( "Build layer %s" ), LSET::Name( layer ) ) );

        bufferPolys.RemoveAllContours();
        bufferZonesPolys.RemoveAllContours();
        currLayerHoles.RemoveAllContours();

        // Draw track shapes:
        for( TRACK* track = pcb->m_Track;  track;  track = track->Next() )
        {
            if( !track->IsOnLayer( layer ) )
                continue;

            track->TransformShapeWithClearanceToPolygon( bufferPolys,
                                                         0, segcountforcircle,
                                                         correctionFactor );

            // Add blind/buried via holes
            if( track->Type() == PCB_VIA_T )
            {
                VIA *via = static_cast<VIA*>( track );

                if( via->GetViaType() == VIA_THROUGH )
                    continue;   // already done

                int holediameter = via->GetDrillValue();
                int thickness = GetPrm3DVisu().GetCopperThicknessBIU();
                int hole_outer_radius = (holediameter + thickness) / 2;

                TransformCircleToPolygon( currLayerHoles,
                                          via->GetStart(), hole_outer_radius,
                                          segcountLowQuality );
            }
        }

        // draw pad shapes
        for( MODULE* module = pcb->m_Modules;  module;  module = module->Next() )
        {
//.........这里部分代码省略.........

void ZONE_CONTAINER::buildFeatureHoleList( BOARD* aPcb, SHAPE_POLY_SET& aFeatures )
{
    int segsPerCircle;
    double correctionFactor;

    // Set the number of segments in arc approximations
    if( m_ArcToSegmentsCount == ARC_APPROX_SEGMENTS_COUNT_HIGHT_DEF  )
        segsPerCircle = ARC_APPROX_SEGMENTS_COUNT_HIGHT_DEF;
    else
        segsPerCircle = ARC_APPROX_SEGMENTS_COUNT_LOW_DEF;

    /* calculates the coeff to compensate radius reduction of holes clearance
     * due to the segment approx.
     * For a circle the min radius is radius * cos( 2PI / s_CircleToSegmentsCount / 2)
     * s_Correction is 1 /cos( PI/s_CircleToSegmentsCount  )
     */
    correctionFactor = 1.0 / cos( M_PI / (double) segsPerCircle );

    aFeatures.RemoveAllContours();

    int outline_half_thickness = m_ZoneMinThickness / 2;

    int zone_clearance = std::max( m_ZoneClearance, GetClearance() );
    zone_clearance += outline_half_thickness;

    /* store holes (i.e. tracks and pads areas as polygons outlines)
     * in a polygon list
     */

    /* items ouside the zone bounding box are skipped
     * the bounding box is the zone bounding box + the biggest clearance found in Netclass list
     */
    EDA_RECT item_boundingbox;
    EDA_RECT zone_boundingbox  = GetBoundingBox();
    int      biggest_clearance = aPcb->GetDesignSettings().GetBiggestClearanceValue();
    biggest_clearance = std::max( biggest_clearance, zone_clearance );
    zone_boundingbox.Inflate( biggest_clearance );

    /*
     * First : Add pads. Note: pads having the same net as zone are left in zone.
     * Thermal shapes will be created later if necessary
     */
    int item_clearance;

    /* Use a dummy pad to calculate hole clerance when a pad is not on all copper layers
     * and this pad has a hole
     * This dummy pad has the size and shape of the hole
    * Therefore, this dummy pad is a circle or an oval.
     * A pad must have a parent because some functions expect a non null parent
     * to find the parent board, and some other data
     */
    MODULE dummymodule( aPcb );    // Creates a dummy parent
    D_PAD dummypad( &dummymodule );

    for( MODULE* module = aPcb->m_Modules;  module;  module = module->Next() )
    {
        D_PAD* nextpad;

        for( D_PAD* pad = module->Pads(); pad != NULL; pad = nextpad )
        {
            nextpad = pad->Next();  // pad pointer can be modified by next code, so
                                    // calculate the next pad here

            if( !pad->IsOnLayer( GetLayer() ) )
            {
                /* Test for pads that are on top or bottom only and have a hole.
                 * There are curious pads but they can be used for some components that are
                 * inside the board (in fact inside the hole. Some photo diodes and Leds are
                 * like this)
                 */
                if( pad->GetDrillSize().x == 0 && pad->GetDrillSize().y == 0 )
                    continue;

                // Use a dummy pad to calculate a hole shape that have the same dimension as
                // the pad hole
                dummypad.SetSize( pad->GetDrillSize() );
                dummypad.SetOrientation( pad->GetOrientation() );
                dummypad.SetShape( pad->GetDrillShape() == PAD_DRILL_SHAPE_OBLONG ?
                                   PAD_SHAPE_OVAL : PAD_SHAPE_CIRCLE );
                dummypad.SetPosition( pad->GetPosition() );

                pad = &dummypad;
            }

            // Note: netcode <=0 means not connected item
            if( ( pad->GetNetCode() != GetNetCode() ) || ( pad->GetNetCode() <= 0 ) )
            {
                item_clearance   = pad->GetClearance() + outline_half_thickness;
                item_boundingbox = pad->GetBoundingBox();
                item_boundingbox.Inflate( item_clearance );

                if( item_boundingbox.Intersects( zone_boundingbox ) )
                {
                    int clearance = std::max( zone_clearance, item_clearance );
                    pad->TransformShapeWithClearanceToPolygon( aFeatures,
                                                               clearance,
                                                               segsPerCircle,
                                                               correctionFactor );
                }

//.........这里部分代码省略.........

//.........这里部分代码省略.........
    case PCB_MODULE_T:
        module = (MODULE*) item;
        break;

    case PCB_MARKER_T:
        marker = (MARKER_PCB*) item;
        break;

    default:
        break;
    }

    // common tests:

    if( module )    // true from case PCB_PAD_T, PCB_MODULE_TEXT_T, or PCB_MODULE_T
    {
        if( m_Guide->IgnoreModulesOnCu() && module->GetLayer()==LAYER_N_BACK )
            goto exit;

        if( m_Guide->IgnoreModulesOnCmp() && module->GetLayer()==LAYER_N_FRONT )
            goto exit;
    }

    // Pads are not sensitive to the layer visibility controls.
    // They all have their own separate visibility controls
    // skip them if not visible
    if( pad )
    {
        if( m_Guide->IgnorePads() )
            goto exit;

        if( ! pad_through )
        {
            if( m_Guide->IgnorePadsOnFront() && pad->IsOnLayer(LAYER_N_FRONT ) )
                goto exit;

            if( m_Guide->IgnorePadsOnBack() && pad->IsOnLayer(LAYER_N_BACK ) )
                goto exit;
        }
    }

    if( marker )
    {
        // Markers are not sensitive to the layer
        if( marker->HitTest( m_RefPos ) )
            Append( item );

        goto exit;
    }

    if( item->IsOnLayer( m_Guide->GetPreferredLayer() ) || m_Guide->IgnorePreferredLayer() )
    {
        LAYER_NUM layer = item->GetLayer();

        // Modules and their subcomponents: text and pads are not sensitive to the layer
        // visibility controls.  They all have their own separate visibility controls
        // for vias, GetLayer() has no meaning, but IsOnLayer() works fine
        if( via || module || pad || m_Guide->IsLayerVisible( layer ) || !m_Guide->IgnoreNonVisibleLayers() )
        {
            if( !m_Guide->IsLayerLocked( layer ) || !m_Guide->IgnoreLockedLayers() )
            {
                if( !item->IsLocked() || !m_Guide->IgnoreLockedItems() )
                {
                    if( item->HitTest( m_RefPos ) )
                    {
                        Append( item );

/**
 * Function buildBoard3DAuxLayers
 * Called by CreateDrawGL_List()
 * Fills the OpenGL GL_ID_BOARD draw list with items
 * on aux layers only
 */
void EDA_3D_CANVAS::buildBoard3DAuxLayers( REPORTER* aErrorMessages, REPORTER* aActivity )
{
    const int   segcountforcircle   = 18;
    double      correctionFactor    = 1.0 / cos( M_PI / (segcountforcircle * 2) );
    BOARD*      pcb = GetBoard();

    SHAPE_POLY_SET  bufferPolys;

    static const LAYER_ID sequence[] = {
        Dwgs_User,
        Cmts_User,
        Eco1_User,
        Eco2_User,
        Edge_Cuts,
        Margin
    };

    for( LSEQ aux( sequence, sequence+DIM(sequence) );  aux;  ++aux )
    {
        LAYER_ID layer = *aux;

        if( !is3DLayerEnabled( layer ) )
            continue;

        if( aActivity )
            aActivity->Report( wxString::Format( _( "Build layer %s" ), LSET::Name( layer ) ) );

        bufferPolys.RemoveAllContours();

        for( BOARD_ITEM* item = pcb->m_Drawings; item; item = item->Next() )
        {
            if( !item->IsOnLayer( layer ) )
                continue;

            switch( item->Type() )
            {
            case PCB_LINE_T:
                ( (DRAWSEGMENT*) item )->TransformShapeWithClearanceToPolygon(
                    bufferPolys, 0, segcountforcircle, correctionFactor );
                break;

            case PCB_TEXT_T:
                ( (TEXTE_PCB*) item )->TransformShapeWithClearanceToPolygonSet(
                    bufferPolys, 0, segcountforcircle, correctionFactor );
                break;

            default:
                break;
            }
        }

        for( MODULE* module = pcb->m_Modules; module; module = module->Next() )
        {
            module->TransformPadsShapesWithClearanceToPolygon( layer,
                                                               bufferPolys,
                                                               0,
                                                               segcountforcircle,
                                                               correctionFactor );

            module->TransformGraphicShapesWithClearanceToPolygonSet( layer,
                                                                     bufferPolys,
                                                                     0,
                                                                     segcountforcircle,
                                                                     correctionFactor );
        }

        // bufferPolys contains polygons to merge. Many overlaps .
        // Calculate merged polygons and remove pads and vias holes
        if( bufferPolys.IsEmpty() )
            continue;

        bufferPolys.Simplify( polygonsCalcMode );

        int         thickness = GetPrm3DVisu().GetLayerObjectThicknessBIU( layer );
        int         zpos = GetPrm3DVisu().GetLayerZcoordBIU( layer );
        // for Draw3D_SolidHorizontalPolyPolygons,
        // zpos it the middle between bottom and top sides.
        // However for top layers, zpos should be the bottom layer pos,
        // and for bottom layers, zpos should be the top layer pos.
        if( Get3DLayer_Z_Orientation( layer ) > 0 )
            zpos += thickness/2;
        else
            zpos -= thickness/2 ;

        float zNormal = 1.0f; // When using thickness it will draw first the top and then botton (with z inverted)

        // If we are not using thickness, then the znormal must face the layer direction
        // because it will draw just one plane
        if( !thickness )
            zNormal = Get3DLayer_Z_Orientation( layer );

        setGLTechLayersColor( layer );
        Draw3D_SolidHorizontalPolyPolygons( bufferPolys, zpos,
                                            thickness, GetPrm3DVisu().m_BiuTo3Dunits, false,
//.........这里部分代码省略.........

/**
 * Function ConvertBrdLayerToPolygonalContours
 * Build a set of polygons which are the outlines of copper items
 * (pads, tracks, texts, zones)
 * the holes in vias or pads are ignored
 * Usefull to export the shape of copper layers to dxf polygons
 * or 3D viewer
 * the polygons are not merged.
 * @param aLayer = A layer, like LAYER_N_BACK, etc.
 * @param aOutlines The CPOLYGONS_LIST to fill in with main outlines.
 * @return true if success, false if a contour is not valid
 */
void BOARD::ConvertBrdLayerToPolygonalContours( LAYER_NUM aLayer, CPOLYGONS_LIST& aOutlines )
{
    // Number of segments to convert a circle to a polygon
    const int       segcountforcircle   = 18;
    double          correctionFactor    = 1.0 / cos( M_PI / (segcountforcircle * 2) );

    // convert tracks and vias:
    for( TRACK* track = m_Track; track != NULL; track = track->Next() )
    {
        if( !track->IsOnLayer( aLayer ) )
            continue;

        track->TransformShapeWithClearanceToPolygon( aOutlines,
                0, segcountforcircle, correctionFactor );
    }

    // convert pads
    for( MODULE* module = m_Modules; module != NULL; module = module->Next() )
    {
        module->TransformPadsShapesWithClearanceToPolygon( aLayer,
                aOutlines, 0, segcountforcircle, correctionFactor );

        // Micro-wave modules may have items on copper layers
        module->TransformGraphicShapesWithClearanceToPolygonSet( aLayer,
                aOutlines, 0, segcountforcircle, correctionFactor );
    }

    // convert copper zones
    for( int ii = 0; ii < GetAreaCount(); ii++ )
    {
        ZONE_CONTAINER* zone = GetArea( ii );
        LAYER_NUM       zonelayer = zone->GetLayer();

        if( zonelayer == aLayer )
            zone->TransformSolidAreasShapesToPolygonSet(
                aOutlines, segcountforcircle, correctionFactor );
    }

    // convert graphic items on copper layers (texts)
    for( BOARD_ITEM* item = m_Drawings; item; item = item->Next() )
    {
        if( !item->IsOnLayer( aLayer ) )
            continue;

        switch( item->Type() )
        {
        case PCB_LINE_T:    // should not exist on copper layers
            ( (DRAWSEGMENT*) item )->TransformShapeWithClearanceToPolygon(
                aOutlines, 0, segcountforcircle, correctionFactor );
            break;

        case PCB_TEXT_T:
            ( (TEXTE_PCB*) item )->TransformShapeWithClearanceToPolygonSet(
                aOutlines, 0, segcountforcircle, correctionFactor );
            break;

        default:
            break;
        }
    }
}

//.........这里部分代码省略.........
    int      biggest_clearance = aPcb->GetDesignSettings().GetBiggestClearanceValue();
    biggest_clearance = std::max( biggest_clearance, zone_clearance );
    zone_boundingbox.Inflate( biggest_clearance );

    /*
     * First : Add pads. Note: pads having the same net as zone are left in zone.
     * Thermal shapes will be created later if necessary
     */
    int item_clearance;

    // static to avoid unnecessary memory allocation when filling many zones.
    static CPOLYGONS_LIST cornerBufferPolysToSubstract;
    cornerBufferPolysToSubstract.RemoveAllContours();

    /* Use a dummy pad to calculate hole clerance when a pad is not on all copper layers
     * and this pad has a hole
     * This dummy pad has the size and shape of the hole
    * Therefore, this dummy pad is a circle or an oval.
     * A pad must have a parent because some functions expect a non null parent
     * to find the parent board, and some other data
     */
    MODULE dummymodule( aPcb );    // Creates a dummy parent
    D_PAD dummypad( &dummymodule );

    for( MODULE* module = aPcb->m_Modules;  module;  module = module->Next() )
    {
        D_PAD* nextpad;

        for( D_PAD* pad = module->Pads(); pad != NULL; pad = nextpad )
        {
            nextpad = pad->Next();  // pad pointer can be modified by next code, so
                                    // calculate the next pad here

            if( !pad->IsOnLayer( GetLayer() ) )
            {
                /* Test for pads that are on top or bottom only and have a hole.
                 * There are curious pads but they can be used for some components that are
                 * inside the board (in fact inside the hole. Some photo diodes and Leds are
                 * like this)
                 */
                if( pad->GetDrillSize().x == 0 && pad->GetDrillSize().y == 0 )
                    continue;

                // Use a dummy pad to calculate a hole shape that have the same dimension as
                // the pad hole
                dummypad.SetSize( pad->GetDrillSize() );
                dummypad.SetOrientation( pad->GetOrientation() );
                dummypad.SetShape( pad->GetDrillShape() == PAD_DRILL_OBLONG ?
                                   PAD_OVAL : PAD_CIRCLE );
                dummypad.SetPosition( pad->GetPosition() );

                pad = &dummypad;
            }

            // Note: netcode <=0 means not connected item
            if( ( pad->GetNetCode() != GetNetCode() ) || ( pad->GetNetCode() <= 0 ) )
            {
                item_clearance   = pad->GetClearance() + margin;
                item_boundingbox = pad->GetBoundingBox();
                item_boundingbox.Inflate( item_clearance );

                if( item_boundingbox.Intersects( zone_boundingbox ) )
                {
                    int clearance = std::max( zone_clearance, item_clearance );
                    pad->TransformShapeWithClearanceToPolygon( cornerBufferPolysToSubstract,
                                                               clearance,